Inspection Equipment×アイテス - List of Manufacturers, Suppliers, Companies and Products

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

Inspection equipment effective for initial observation of various components and materials, including implementation substrates and electronic parts.

The "Cheetah EVO" is an X-ray inspection and CT scanning device equipped with a reflow simulator, allowing real-time observation of behaviors such as voids during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF materials or feel free to contact us.

Company：アイテス
Price：Other

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X-ray fluoroscopy and CT examination device 'Observation case of IC type coil'

X-ray CT observation allows for the assessment of the winding condition of coil wiring! We will introduce examples of observing IC-type coils, which differ from X-ray transmission observation.

Here are some observation examples of IC-type coils. By using appropriate methods for X-ray observation, we can clearly capture the internal structure according to the purpose. In transmission observation, we can quickly detect metal foreign objects, and in CT observation, we can obtain three-dimensional images of arbitrary cross-sections, making it suitable for observations where positional information and shape are important. Unlike transmission observation, we can also assess the winding condition of the coil wiring. *For more details, please refer to the PDF materials or feel free to contact us.

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X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study

X-ray fluoroscopy observation, oblique CT observation, orthogonal CT observation, etc.! Introduction of BGA solder crack analysis cases.

We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection area identified through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
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X-ray fluoroscopy and CT examination device: Case study of wisdom tooth observation

[Video available] Introducing the X-ray CT image (orthogonal CT) of a wisdom tooth (third molar).

We would like to introduce a case of observing a wisdom tooth (third molar) using X-ray CT. Over 10 years ago, the extracted wisdom tooth of the photographer was observed using X-ray CT. Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin were clearly observed. [Observation Case of Wisdom Tooth] ■Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin can be clearly observed. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray inspection equipment
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X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, allowing for a clear understanding of the condition of the abnormal areas. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT examination device: Observation case of a microphone

[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.

We would like to introduce a case study of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounting substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphones] ■ X-ray Fluoroscopic Images - Wire bonding and wiring patterns of the mounting substrate can be observed. ■ Orthogonal CT Images - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.

Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmitted observation and image processing technology.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmission X-ray images of normal substrates and defective substrates, the wiring was intricately arranged, and abnormalities were not apparent at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon examining the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.

X-ray observation is a method of non-destructive testing and is the first inspection conducted for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented circuit boards and electronic parts. Additionally, CT inspection allows for three-dimensional structural capture, enabling visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■ YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

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[Case Study] X-ray Fluoroscopy and CT Examination Equipment

Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopic observation and oblique CT observation, as well as cases of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopic observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopic observation & orthogonal CT observation)... ★ Currently offering the 【X-ray fluoroscopy and CT inspection equipment case collection】 for free! You can view it immediately from the "PDF download." *For more details, please refer to the PDF document or feel free to contact us.

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X-ray inspection equipment
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MLCC crack X-ray observation

Cracks that couldn't be detected visually might be found with X-rays!

When stress such as warping, bending, or twisting is applied to the printed circuit board, cracks may occur inside the MLCC (Multi-Layer Ceramic Chip Capacitor). Additionally, cracks that occur internally are often hidden by the electrodes, making it difficult to detect them from the exterior. In such cases, how about checking with X-rays? [Observation Details] ■ Oblique CT Observation It is possible to perform CT without destroying the printed circuit board, in its original state. ■ Orthogonal CT Observation It is possible to observe the shape of the components in their original state. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray inspection equipment
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Observation of aluminum welding joints

Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

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SiC potential defect expansion inspection device

Reproducing bipolar degradation through UV laser irradiation! Sample evaluation that normally takes 2 months can be completed in 2 days.

This product is a SiC defect inspection device that reveals defects that had not manifested without electrical current by using UV laser irradiation, thereby shortening the evaluation cycle of research and development. 【Features】 ■ UV Irradiation - Achieves uniform laser irradiation from small sizes like chips to the entire wafer. - Calculates hole concentration from epitaxial thickness and doping concentration, and proposes radiation intensity corresponding to current density. ■ PL Measurement Function - Observes defects from multiple angles at wavelengths of 380nm, 420nm, and over 700nm. - Enables identification and classification of layered defects (buffer layer, drift layer, substrate interface) using image processing technology. - Includes mapping function with coordinates of defect occurrence. * Please feel free to consider a trial measurement (free of charge) first. * For more details, please download the PDF or feel free to contact us.

Company：アイテス
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Inspection Equipment×アイテス - List of Manufacturers, Suppliers, Companies and Products

Inspection Equipment Product List

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

X-ray fluoroscopy and CT examination device 'Observation case of IC type coil'

X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study

X-ray fluoroscopy and CT examination device: Case study of wisdom tooth observation

X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

X-ray fluoroscopy and CT examination device: Observation case of a microphone

X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.

X-ray fluoroscopy and CT scanner: Device appearance and main specifications

[Case Study] X-ray Fluoroscopy and CT Examination Equipment

MLCC crack X-ray observation

Observation of aluminum welding joints

SiC potential defect expansion inspection device

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